We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall)　Dec 11 to 13, 2023（10:00 am–5:00 pm JST）　

For top players in semiconductor packaging and PCB mounting

Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

Exhibit Products:
1. High Adhesion-easy Removable UV Tape  SELFA™
2. Clean Container series
3. High-viscosity inkjet ink
4. EPOXY FLUX (Under development)
5. Adhesive (PSA) Dot Connector

Sekisui Chemical Exhibit Area　 East Exhibition Hall 3452

We provide advanced high-performance materials that help solve social issues. Please stop by our booth.

Nov. 12, 2024