Date：September 25-27, 2024 (Wed-Fri)
Venue：
September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel
Official Website：https://3dic-conf.org/

Our Schedule

■ Session Presentation
Title：
"A Temporary Bonding De-Bonding Tape with High Thermal Resistance,
Easy Peeling and Excellent TTV for 3DIC"
Presentation Date & Time：September 26, 10:45 AM - 11:05 AM
※3DIC_Program_Schedule : For more details

■ Booth Exhibition
Exhibition Period：September 26, 2024 - September 27, 2024
Venue：Sendai Kokusai Hotel
Booth Number：#12

2024.09.12